Japan, Sept. 3 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RESIN COMPOSITION FOR TRANSFER MOLDING SEALING AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2024-065758
Category (FI): C08K3/013,C08G59/40,H01L23/30@R,H10W74/47,C08G59/62,C08G59/42,C08L63/00@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 15, 2024
Publication Date: July 5, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....