Japan, Feb. 12 -- NITTO DENKO CORP has got intellectual property rights for 'RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR, RESIN MOLDING FOR ENCAPSULATING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR ENCAPSULATION MATERIAL AND OPTICAL SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-026901

Category (FI): C08K5/00,H01L33/56,H10H20/854,C08G59/62,C08L63/00@C

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Feb. 24, 2022

Publication Date: Oct. 17, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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