Japan, Sept. 3 -- TOKUYAMA CORP has got intellectual property rights for 'RESIN COMPOSITION, SEMICONDUCTOR SEALANT AND PREDICTION DEVICE.' Other related details are as follows:
Application Number: JP,2022-172762
Category (FI): H01L23/30@R,C08L63/00@C,H10W74/47,C08L101/00,C01B33/18@C,C08K3/36,C08K9/06
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 27, 2022
Publication Date: May 14, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....