Japan Intellectual Property Rights: RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

Japan, Feb. 12 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE.' Other related details are as follows:

Application Number: JP,2022-067892

Category (FI): B32B15/08@J,C08J5/24,C08L101/00,C08L53/02,C08L9/00,C08L9/06,H01L23/14@R,H05K1/03,610@H,H05K1/03,610@K,H05K1/03,610@L,H05K1/03,610@M,H05K1/03,610@N,H05K1/03,610@R,H05K1/03,610@S,H10W70/695

Stage: Grant (IP right granted following substantive examination.)

Filing Date: April 15, 2022

Publication Date: Oct. 26, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....