Japan, March 25 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR PRODUCING RESIN COMPOSITION AND RESIN.' Other related details are as follows:
Application Number: JP,2022-005312
Category (FI): C08L101/00,C08L35/00,C08F212/34,C08F222/40,C08L35/06,C08J5/24,C08L53/02,C08L71/12,C08K5/14,C08K5/3445,C08K3/013,C08L25/10
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 17, 2022
Publication Date: July 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....