Japan, Aug. 6 -- MITSUBISHI ENGINEERING PLASTICS CORP has got intellectual property rights for 'RESIN COMPOSITION, MOLDING, AND ELECTROMAGNETIC WAVE ABSORBER.' Other related details are as follows:
Application Number: JP,2021-204655
Category (FI): H05K9/00@X,C08L83/04,C08L101/00,C08L67/02,C08L21/00,C08K3/04,C08L23/0869,C08L63/00@A,C08J3/22,H05K9/00@M
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 16, 2021
Publication Date: June 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....