Japan, March 24 -- ASAHI KASEI CORP has got intellectual property rights for 'RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC CIRCUIT BOARD MATERIAL, RESIN FILM, PREPREG, AND LAMINATE.' Other related details are as follows:
Application Number: JP,2022-059766
Category (FI): B32B15/08@U,B32B27/00,104,B32B27/30@B,C08F297/00,C08G73/00,C08J5/18,C08J5/24,C08K5/16,C08K5/315,C08K5/3415,C08L53/02,H05K1/03,610@H,H05K1/03,630@H
Stage: Grant (IP right document published.)
Filing Date: March 31, 2022
Publication Date: Oct. 16, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....