Japan, July 1 -- LAPLACE SYSTEM CO LTD has got intellectual property rights for 'RELAY MODULE AND RELAY TERMINAL BASE USING THE SAME.' Other related details are as follows:

Application Number: JP,2025-021962

Category (FI): H01R31/06@M,G06F3/00@P,G05B19/042

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Feb. 14, 2025

Publication Date: May 14, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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