Japan, June 16 -- LAM RESEARCH CORPORATION has got intellectual property rights for 'REDUCTION OF SIDEWALL NOTCHING FOR HIGH ASPECT RATIO 3D NAND ETCHING.' Other related details are as follows:
Application Number: JP,2025-003144
Category (FI): H10P50/28,H01L21/302,105@A,H10P50/20,105@A,H10P50/24
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 9, 2025
Publication Date: April 15, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....