Japan, July 1 -- DISCO CORP has got intellectual property rights for 'PROTECTIVE SHEET AND WAFER PROCESSING METHOD USING SAME.' Other related details are as follows:

Application Number: JP,2022-188182

Category (FI): H10P52/00@M,H01L21/304,622@J,H01L21/304,631,H01L21/68@N,B24B41/06@L,H10P52/00@C,H10P72/70

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 25, 2022

Publication Date: June 6, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....