Japan, April 1 -- LINTEC CORP has got intellectual property rights for 'PROTECTIVE FILM-FORMING FILM, PROTECTIVE FILM-FORMING COMPOSITE SHEET, PROTECTIVE FILM-EQUIPPED SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-048151
Category (FI): C08G59/40,C08J5/18,C09J7/38,H01L21/78@M,H01L23/30@D,H10P58/00@A,H10P58/00@M,H10W74/10@N,H10W74/15,H10W74/40@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 24, 2022
Publication Date: Oct. 5, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....