Japan, Sept. 3 -- SEIKO EPSON CORP has got intellectual property rights for 'PRODUCTION METHOD OF MOLDING.' Other related details are as follows:
Application Number: JP,2022-011725
Category (FI): D04H1/587,D04H1/60
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 28, 2022
Publication Date: Jan. 18, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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