Japan, May 18 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'PROCESSING METHOD OF WAFER.' Other related details are as follows:
Application Number: JP,2022-044201
Category (FI): H01L21/68@N,H01L21/78@S,H10P58/00@S,H10P72/70
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 18, 2022
Publication Date: Sept. 29, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....