Japan, Aug. 6 -- INVENSAS BONDING TECHNOLOGIES INC has got intellectual property rights for 'PROCESSED LAMINATION DIE.' Other related details are as follows:
Application Number: JP,2022-131656
Category (FI): H10W90/20@Z,H01L21/02@B,H01L21/304,643@A,H01L25/08@Y,H10P70/00,103@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 22, 2022
Publication Date: Oct. 25, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....