Japan, March 6 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND ORGANIC EL DEVICE BARRIER.' Other related details are as follows:
Application Number: JP,2021-215053
Category (FI): G03F7/004,501,C08L63/06,C08L33/04,C08L101/00,H10K50/86,865,H10K50/86,H10K50/85,H10K85/00,H10K59/95,H05B33/12@B,H05B33/14@A,H05B33/22@Z,H10K50/10,H10K59/80,865,H10K50/84,H10K59/00,C08K5/1535,H10K85/10,G03F7/023,G03F7/004,505,H10K59/122,H10K59/10,C08K5/101,C08K5/42,H10K59/80,860,H10K59/80,850,H10K59/80,830,H10K59/35,H10K59/30,H10K59/126,H10K59/124
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 28, 2021
Publication Date: July 10, 2023
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