Japan, June 10 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'POLYAMIDE-IMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2024-192033
Category (FI): H10W74/47,100,C08G73/14,H10W74/47,H01L23/30@R
Stage: Grant (IP right document published.)
Filing Date: Oct. 31, 2024
Publication Date: Feb. 19, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....