Japan, Jan. 28 -- SK ENPULSE CO LTD has got intellectual property rights for 'POLISHING PAD WITH REDUCED DEFECT GENERATION AND METHOD OF PREPARING SEMICONDUCTOR DEVICE USING THE SAME.' Other related details are as follows:

Application Number: JP,2024-106264

Category (FI): B24B37/00@H,B24B37/24@C,B24B53/017@Z,B24B53/12@Z,H01L21/304,622@F,H10P52/00@D,H10P52/40

Stage: Grant (IP right document published.)

Filing Date: July 1, 2024

Publication Date: Feb. 6, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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