Japan Intellectual Property Rights: POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE USING THE SAME

Japan, Sept. 7 -- SK ENPULSE CO LTD has got intellectual property rights for 'POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE USING THE SAME.' Other related details are as follows:

Application Number: JP,2024-151747

Category (FI): H01L21/304,622@D,C09K3/14,550@D,C09K3/14,550@Z,H10P52/00@H,H10P52/40,H10P52/00@D

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 3, 2024

Publication Date: April 16, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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