Japan, Feb. 6 -- TOKYO SEIMITSU CO LTD has got intellectual property rights for 'PLANARIZATION METHOD FOR SEMICONDUCTOR WAFER SURFACE.' Other related details are as follows:
Application Number: JP,2022-005441
Category (FI): H01L21/304,601@Z,H10P54/20,201,H10P95/60@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 18, 2022
Publication Date: July 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....