Japan, April 22 -- HD MICROSYSTEMS LTD has got intellectual property rights for 'PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PATTERN, AND ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2022-095240

Category (FI): G03F7/20,501,G03F7/027,514,G03F7/004,501,G03F7/027,502,G03F7/20,521,C08G73/12,C08F290/14

Stage: Grant (IP right granted following substantive examination.)

Filing Date: June 13, 2022

Publication Date: Dec. 25, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....