Japan, Aug. 26 -- ABSOLICS INC has got intellectual property rights for 'PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME.' Other related details are as follows:

Application Number: JP,2024-198609

Category (FI): H05K3/46@B,H10W70/05,200,H10W70/63,H10W70/68,200,H05K3/46@T,H01L23/12@C

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 13, 2024

Publication Date: June 4, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....