Japan, June 10 -- ABLIC INC has got intellectual property rights for 'PACKAGE SUBSTRATE AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-048874
Category (FI): H01L21/92,602@B,H10W70/00@E,H10W72/20,101@A,H01L23/12@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 24, 2022
Publication Date: Oct. 5, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....