Japan, Feb. 12 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'MULTILAYERED ELECTRONIC COMPONENT.' Other related details are as follows:
Application Number: JP,2021-166447
Category (FI): H01G4/30,201@L,H01G4/30,201@N,H01G4/30,515
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 8, 2021
Publication Date: July 29, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....