Japan, Nov. 12 -- IBIDEN CO LTD has got intellectual property rights for 'MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2022-166458
Category (FI): H05K3/46@T,H05K1/16@B,H05K3/46@N,H05K1/11@H,H05K3/40@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 17, 2022
Publication Date: April 30, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....