Japan, Oct. 30 -- BESPACK KK has got intellectual property rights for 'MULTILAYER THERMOPLASTIC RESIN SHEET.' Other related details are as follows:
Application Number: JP,2023-002675
Category (FI): B32B27/30,102,B65D65/40@D,B32B27/34,B32B27/32@E
Stage: Grant (IP right document published.)
Filing Date: Jan. 11, 2023
Publication Date: July 24, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....