Japan, Jan. 28 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'MULTILAYER ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2021-180698

Category (FI): H01G4/30,513,H01G4/30,516,H01G4/30,201@F,H01G4/30,201@G

Stage: Grant (IP right document published.)

Filing Date: Nov. 4, 2021

Publication Date: July 6, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....