Japan, Aug. 26 -- RICOH CO LTD has got intellectual property rights for 'MOLDING LIQUID, KIT FOR MOLDING, AND METHOD FOR MANUFACTURING MOLDED OBJECTS.' Other related details are as follows:
Application Number: JP,2022-036965
Category (FI): B33Y10/00,B33Y40/20,B29C64/165,B22F10/14,B22F3/10@C,B22F3/02@M,B22F1/00@N,B22F1/00@R,B33Y70/00,B29C64/209,B29C64/35
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 10, 2022
Publication Date: July 19, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....