Japan, Oct. 30 -- DENSO CORP,HAMAMATSU PHOTONICS KK,TOKAI NATIONAL HIGHER EDUCATION & RESEARCH SYSTEM,MIRISE TECHNOLOGIES CORP,TOYOTA MOTOR CORP has got intellectual property rights for 'METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR WAFER PROCESSING APPARATUS.' Other related details are as follows:
Application Number: JP,2022-005951
Category (FI): H01L21/304,611@Z,H01L21/78@B
Stage: Grant (IP right document published.)
Filing Date: Jan. 18, 2022
Publication Date: July 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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