Japan Intellectual Property Rights: METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Japan, July 14 -- TOSHIBA CORP,TOSHIBA ELECTRONIC DEVICES & STORAGE CORP has got intellectual property rights for 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2023-044971

Category (FI): H01L21/304,621@E,H10P52/00@Y,H10P52/00@R

Stage: PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can be easily manufactured.SOLUTION: Provided is a method of manufacturing a semiconductor device from a semiconductor substrate, a substrate and a sheet. The semiconductor substrate includes a first part including a first surface and a second surface provided on an opposite side of the first surface, and an annular second part surrounding the second surface a...