Japan, Jan. 28 -- SEIKO EPSON CORP has got intellectual property rights for 'METHOD OF MANUFACTURING MOLDING DIE, AND MOLDING DIE.' Other related details are as follows:

Application Number: JP,2022-069829

Category (FI): B33Y80/00,B29C64/106,B29C45/26,B33Y10/00,B29C33/38

Stage: Grant (IP right document published.)

Filing Date: April 21, 2022

Publication Date: Nov. 2, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....