Japan, May 13 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'METHOD FOR PROCESSING WAFER.' Other related details are as follows:
Application Number: JP,2022-132236
Category (FI): H01L21/02@C,H10P52/00@C,H10P10/00@A,H10P54/92,H01L21/304,631
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 23, 2022
Publication Date: March 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....