Japan, Feb. 18 -- SUMCO CORP has got intellectual property rights for 'METHOD FOR POLISHING ONE SIDE OF SOI WAFER.' Other related details are as follows:
Application Number: JP,2022-203775
Category (FI): H01L21/304,622@W,H10P52/00@W,H01L21/304,622@S,H01L21/304,621@B,H10P52/00@V,H10P52/00@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 20, 2022
Publication Date: July 2, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....