Japan, Jan. 19 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING SiC SUBSTRATE AND SLURRY FOR WRAPPING PROCESSING.' Other related details are as follows:
Application Number: JP,2021-166999
Category (FI): B24B37/00@H,B24B37/08,B24B37/10,C09K3/14,550@Z,H01L21/304,621@A,H01L21/304,621@D,H01L21/304,622@D,H10P52/00@B,H10P52/00@E,H10P52/00@H
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 11, 2021
Publication Date: April 21, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....