Japan Intellectual Property Rights: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Japan, Sept. 16 -- KIOXIA CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-098828

Category (FI): H01L29/78,371,H10B80/00,H10B43/27,H10B41/27,H10D30/01,501,H10D30/68,H10D30/69,H10W90/20@Z,H10W80/00@A,H10W80/00@Z,H10P10/00@A,H10P10/00@X,H01L25/08@Y,H01L21/02@B,H01L21/02@C,H01L27/11582,H01L27/11556

Stage: PROBLEM TO BE SOLVED: To properly join a plurality of substrates.SOLUTION: According to one embodiment, a method for manufacturing a semiconductor device includes steps of: forming a fist structure on a first substrate; forming a first joined body by joining a support substrate having lower rigidity than the first substrate to a ...