Japan, July 27 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING METAL FOIL WITH RESIN, METHOD FOR MANUFACTURING LAMINATE PLATE, METHOD FOR MANUFACTURING PRINT CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2022-101053
Category (FI): B32B15/08,101@Z,H05K3/00@J,B32B15/08@J,H05K1/03,630@H,B32B15/08@U,B32B38/18@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 23, 2022
Publication Date: Jan. 11, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....