Japan, March 24 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'METHOD FOR MANUFACTURING CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2022-071375

Category (FI): H01B13/00@Z,H01G4/30,201@D,H01G4/30,311@D,H01G4/30,516,H01G4/30,517

Stage: Grant (IP right document published.)

Filing Date: April 25, 2022

Publication Date: Aug. 21, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....