Japan, Sept. 3 -- DISCO CORP has got intellectual property rights for 'METHOD FOR GRINDING WAFER.' Other related details are as follows:
Application Number: JP,2022-135773
Category (FI): H01L21/304,631,H10P52/00@C,B24B1/00@F,B24B7/04@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 29, 2022
Publication Date: March 12, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....