Japan, Aug. 6 -- SUMCO CORP has got intellectual property rights for 'METHOD FOR EVALUATING GETTERING CAPACITY OF SILICON WAFER AND METHOD FOR MANUFACTURING SILICON WAFER.' Other related details are as follows:

Application Number: JP,2023-134069

Category (FI): H10P74/20@N,H01L21/66@N

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 21, 2023

Publication Date: March 6, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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