Japan, Oct. 30 -- JST CORP has got intellectual property rights for 'METHOD FOR ELECTROMAGNETIC INTERFERENCE (EMI) PROTECTION FOR CONNECTOR ASSEMBLY USING CONDUCTIVE SEAL.' Other related details are as follows:
Application Number: JP,2024-071828
Category (FI): H05K9/00@L,H01R13/533@B,H01R13/6599
Stage: Grant (IP right document published.)
Filing Date: April 25, 2024
Publication Date: July 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....