Japan, Sept. 28 -- SHIN ETSU HANDOTAI CO LTD has got intellectual property rights for 'METHOD FOR APPLYING RESIN TO WAFER AND MANUFACTURING METHOD OF WAFER.' Other related details are as follows:

Application Number: JP,2023-095105

Category (FI): B24B7/00@Z,B24B41/06@L,H01L21/304,631,H10P52/00@C

Stage: Grant (IP right granted following substantive examination.)

Filing Date: June 8, 2023

Publication Date: Dec. 19, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....