Japan, Oct. 30 -- EV GROUP E THALLNER GMBH has got intellectual property rights for 'METHOD AND APPARATUS FOR BONDING SUBSTRATE.' Other related details are as follows:
Application Number: JP,2024-166364
Category (FI): H01L21/68@N,H01L21/02@B
Stage: Grant (IP right document published.)
Filing Date: Sept. 25, 2024
Publication Date: Jan. 7
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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