Japan, Nov. 12 -- DIC CORP has got intellectual property rights for 'MATERIAL FOR MOLDING OR FORMING AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:

Application Number: JP,2022-082161

Category (FI): B29B9/06,C08J11/06,B29B17/04,B29B13/10,B02C18/00,106@B

Stage: Grant (IP right granted following substantive examination.)

Filing Date: May 19, 2022

Publication Date: Dec. 1, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....