Japan, Oct. 29 -- ELEPHANTECH INC has got intellectual property rights for 'MANUFACTURING METHOD OF PRINTING CIRCUIT BOARD AND CONDUCTIVE GROUND LAYER FORMATION METHOD.' Other related details are as follows:
Application Number: JP,2021-156187
Category (FI): H05K3/40@K,H05K3/00@N
Stage: Grant(IP right document published.)
Filing Date: Sept. 24, 2021
Publication Date: April 5, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....