Japan Intellectual Property Rights: MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME

Japan, March 5 -- ABSOLICS INC has got intellectual property rights for 'MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME.' Other related details are as follows:

Application Number: JP,2024-145545

Category (FI): H10W70/68,200,H10W70/692,H10W70/695,H10W70/00@F,H05K3/46@T,H05K3/46@Q,H01L23/14@R,H01L23/14@C,H01L23/12@F

Stage: PROBLEM TO BE SOLVED: To provide a packaging substrate which prevents an undulation phenomenon due to a gap between elements and/or a gap between a cavity portion and an element, and a manufacturing method thereof.SOLUTION: A packaging substrate includes a core layer 22 including a glass substrate 21 having a first surface and a second surface facing each other and a cavity portion pas...