Japan, March 5 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'MANUFACTURING METHOD OF DEVICE CHIP.' Other related details are as follows:
Application Number: JP,2021-194641
Category (FI): H01L21/302,102,H10P58/00@W,H10P58/00@S,H10P58/00@L,H10P58/00@B,H10P50/20,400,H10P50/20,102,H10P50/20,101@B,B23K26/364,H01L21/302,101@B,H01L21/461,H01L21/78@W,H01L21/78@S,H01L21/78@B,H01L21/78@L
Stage: PROBLEM TO BE SOLVED: To provide a manufacturing method of a device chip, capable of suppressing hardening of a resin layer as compared with a conventional one.SOLUTION: A manufacturing method of manufacturing a device chip containing a device by dividing a plate-like processed material provided with the device by a division scheduled...