Japan Intellectual Property Rights: MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE INCLUDING DIODE

Japan, April 22 -- DENSO CORP has got intellectual property rights for 'MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE INCLUDING DIODE.' Other related details are as follows:

Application Number: JP,2023-067962

Category (FI): H10P34/42@G,H10D30/01,301@H,H10D8/50@C,H01L21/268@G,H01L21/268@F,H01L29/91@C,H10D30/66,201@A,H01L29/78,658@A,H01L29/78,653@A,H01L29/78,657@D,H01L29/91@J,H01L29/78,655@D,H01L29/78,658@H,H10D84/80,203@D,H10D30/01,301@A,H10D12/00,101@R,H10D8/50@J,H10P34/42@J,H10P34/42@F

Stage: Grant (IP right granted following substantive examination.)

Filing Date: April 18, 2023

Publication Date: Oct. 30, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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