Japan, Nov. 7 -- SHIN ETSU HANDOTAI CO LTD has got intellectual property rights for 'MANUFACTURING METHOD FOR BONDED TYPE WAFER.' Other related details are as follows:
Application Number: JP,2022-040500
Category (FI): H01L33/30,H10H20/824,H01L21/02@B,H10H20/01@Z
Stage: Grant (IP right document published.)
Filing Date: March 15, 2022
Publication Date: Sept. 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....