Japan, Aug. 6 -- INTEL CORP has got intellectual property rights for 'MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY.' Other related details are as follows:

Application Number: JP,2022-043167

Category (FI): H10W40/60@A,H01L23/40@A,H05K7/20@E

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 17, 2022

Publication Date: Feb. 1, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....