Japan, March 24 -- TAIDA ELECTRONIC IND CO LTD has got intellectual property rights for 'LIQUID COOLING DEVICE AND HEAT DISSIPATION ASSEMBLY STRUCTURE USING THE SAME.' Other related details are as follows:
Application Number: JP,2025-075642
Category (FI): H01L23/46,H05K7/20@N,H10W40/40,H10W40/47
Stage: Grant (IP right document published.)
Filing Date: April 30, 2025
Publication Date: Nov. 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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