Japan, Oct. 30 -- NIPPON STEEL CHEMICAL & MATERIAL CO LTD has got intellectual property rights for 'LIGHT- OR HEAT-CURABLE RESIN COMPOSITION AND CURED RESIN THEREOF, AND SEMICONDUCTOR PACKAGE AND PRINTED CIRCUIT BOARD INCLUDING THE CURED RESIN.' Other related details are as follows:
Application Number: JP,2021-184508
Category (FI): C08F290/14,H05K1/03,610@H,H05K3/28@D,C08F2/44@Z,H05K3/46@T,C08F299/02,C08G59/16
Stage: Grant (IP right document published.)
Filing Date: Nov. 12, 2021
Publication Date: June 9, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....